4 Patents
- US126222752026Semiconductor Package Having Cooling Systems with Flow Control Devices Within Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US125937362026Power Module Package with Stacked Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US119675402024Integrated Circuit Direct Cooling Systems Having Substrates in Contact with a Cooling Medium
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - 0 cites