16 Patents
- US124602912025Surface Treatment Producing High Conductivity Vias with Simultaneous Polymer Adhesion
Hutchinson Technology Incorporated
0 cites - US123786872025High Aspect Ratio Electroplated Structures and Anisotropic Electroplating Processes
Hutchinson Technology Incorporated
0 cites - US122160132025Miniature Pressure/force Sensor with Integrated Leads
Hutchinson Technology Incorporated
0 cites - US121958702025Microetch Neutralizer Chemistry for Ni—au Plating Defect Elimination
Hutchinson Technology Incorporated
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- US121470592024Sensor Shift Structures in Optical Image Stabilization Suspensions
Hutchinson Technology Incorporated
0 cites - US120442192024Sensor Shift Structures in Optical Image Stabilization Suspensions
Hutchinson Technology Incorporated
0 cites - US119329482024Electroless Nickel Etch Chemistry, Method of Etching and Pretreatment
Hutchinson Technology Incorporated
0 cites - US118982642024Treatment Methods and Solutions for Improving Adhesion of Gold Electroplating on Metal Surfaces
Hutchinson Technology Incorporated
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- US118675752024Miniature Pressure/force Sensor with Integrated Leads
Hutchinson Technology Incorporated
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- US117822862023Shape Memory Alloy Wire Attachment Structures for a Suspension Assembly
Hutchinson Technology Incorporated
0 cites - US117135142023Systems for Electroplating and Methods of Use Thereof
Hutchinson Technology Incorporated
0 cites - US116742352023Plating Method to Reduce or Eliminate Voids in Solder Applied Without Flux
Hutchinson Technology Incorporated
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