6 Patents
- US125036012025Curable Thermally Conductive Polysiloxane Composition with Increased Thixotropic Index
Dow Silicones Corporation
0 cites - US124546142025Thermal Interface Material with Low Dispensing Viscosity, Low Vertical Flow After Dispensing, and Low Thermal Impedance After Cure
Dow Silicones Corporation
0 cites - 0 cites
- US118516032023Thermally Conductive Composition and Methods and Devices in Which Said Composition Is Used
DOW GLOBAL TECHNOLOGIES LLC (DGTL)
0 cites - 0 cites
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