Patents/Inventors

Doohwan Lee

Anyang-siKR16 patents

16 Patents

US124531072025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123880462025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123158222025
Methods of Manufacturing a Fan-out Panel Level Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122834462025
Switch and Electronic Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122437912025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122059392025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120150142024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119623412024
Electronic Device and Method for Wireless Communication
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119424582024
Semiconductor Package Including a Through-electrode Penetrating a Molding Part
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119013012024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118111432023
Oam Multiplexing Communication System and Inter-mode Interference Elimination Method
NIPPON TELEGRAPH AND TELEPHONE CORPORATION
0 cites
US117912302023
Fan-out Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117355322023
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US117215772023
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US116769152023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812632023
Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites