Patents/Inventors

Donguk Kwon

Asan-siKR5 patents

6 Patents

US124631222025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124069172025
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122887452025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122726522025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117495922023
Package-on-package Type Semiconductor Package Including a Lower Semiconductor Package and an Upper Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769042023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites