Patents/Inventors

Dongsam Park

IncheonKR2 patents

3 Patents

US121070282024
Thermally Enhanced FCBGA Package
STATS Chippac Pte. Ltd.
0 cites
US118239732023
Package with Compartmentalized Lid for Heat Spreader and EMI Shield
STATS Chippac Pte. Ltd.
0 cites
US116705632023
Thermally Enhanced FCBGA Package
STATS Chippac Pte. Ltd.
0 cites