Dongming He

7 Patents

• US125641072026

  Package Comprising Optical Integrated Device

  QUALCOMM INCORPORATED

  0 cites
• US125001882025

  Flip-chip Bumping Metal Layer and Bump Structure

  QUALCOMM INCORPORATED

  0 cites
• US121130382024

  Thermal Compression Flip Chip Bump for High Performance and Fine Pitch

  QUALCOMM Incorporated

  0 cites
• US119489092024

  Package Comprising Spacers Between Integrated Devices

  QUALCOMM INCORPORATED

  0 cites
• US117216562023

  Integrated Device Comprising Pillar Interconnect with Cavity

  QUALCOMM INCORPORATED

  0 cites
• US116949822023

  Sidewall Wetting Barrier for Conductive Pillars

  QUALCOMM INCORPORATED

  0 cites
• US115575572023

  Flip-chip Flexible Under Bump Metallization Size

  QUALCOMM INCORPORATED

  0 cites