Patents/Inventors

Dongjoon Oh

Suwon-siKR14 patents

14 Patents

US125937022026
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US124566272025
Dry Etching Apparatus and Wafer Etching System Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124514742025
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US123811512025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123680932025
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US123477602025
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122242562025
Wafer Structure and Semiconductor Device
Samsung Electronics Co., Ltd.
0 cites
US120092882024
Interconnection Structure and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US119963582024
Semiconductor Packages Having First and Second Redistribution Patterns
Samsung Electronics Co., Ltd.
0 cites
US119233092024
Semiconductor Package Including Fine Redistribution Patterns
Samsung Electronics Co., Ltd.
0 cites
US118548932023
Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US117988722023
Interconnection Structure and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116643122023
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116520662023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites