Dong Hoon Oh

5 Patents

• US122059042025

  Wafer-level Design and Wiring Pattern for a Semiconductor Package

  Nepes Co., Ltd.

  0 cites
• US121989972025

  Semiconductor Package Comprising First Molding Layer and Second Molding Layer with Different Thermal Expansion Coefficients

  NEPES CO., Ltd.

  0 cites
• US121837042024

  Semiconductor Package and Method for Manufacturing the Same

  NEPES LAWEH CORPORATION

  0 cites
• US121257752024

  Semiconductor Package and Method for Manufacturing the Same

  NEPES LAWEH CORPORATION

  0 cites
• US121164822024

  Racing Tire Rubber Composition and Method for Manufacturing Same

  KOREA KUMHO PETROCHEMICAL CO., Ltd.

  0 cites