3 Patents
- US119327862024Method for Structurally Joining Substrates Having Different Coefficients of Linear Thermal Expansion
SIKA TECHNOLOGY AG
0 cites - US118915072024Thermosetting Epoxy Resin Composition Having Low Curing Temperature and Good Storage Stability
SIKA TECHNOLOGY AG
0 cites - US116240132023Use of Toughness Improvers for Increasing the Maximum Linear Expansion of Single-component Heat-curing Epoxy Resin Compositions
SIKA TECHNOLOGY AG
0 cites