Do-hyun Kim

4 Patents

• US124889932025

  Substrate Processing Method

  TES CO., Ltd

  0 cites
• US122373042025

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US120498422024

  Coolant Control Module

  Hanon Systems EFP Korea Inc.

  0 cites
• US116643482023

  Substrate Assembly Semiconductor Package Including the Same and Method of Manufacturing 1HE Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites