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Divya Mani
Chandler, AZ
US
2 patents
3 Patents
US11830783
2023
Embedded Substrate Heat Sink for Bottom Side Cooling
Intel Corporation
0 cites
US11640929
2023
Thermal Management Solutions for Cored Substrates
Intel Corporation
0 cites
US11581240
2023
Liquid Thermal Interface Material in Electronic Packaging
Intel Corporation
0 cites