Patents/Inventors

Dingying Xu

Chandler, AZUS9 patents

8 Patents

US125819882026
Microelectronic Assemblies with Through Die Attach Film Connections
Intel Corporation
0 cites
US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US123548832025
Omni Directional Interconnect with Magnetic Fillers in Mold Matrix
Intel Corporation
0 cites
US123411172025
Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites
US122305642025
Package Substrate Z-disaggregation with Liquid Metal Interconnects
Intel Corporation
0 cites
US120682222024
Dummy Die Structures of a Packaged Integrated Circuit Device
Intel Corporation
0 cites
US120339302024
Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites