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Dingying David Xu
Chandler, AZ
US
2 patents
3 Patents
US12494441
2025
BGA Stiffener Attachment with Low Eolife Adhesive Strength at High Solder Joint Stress Area Generated from Enabling Load
Intel Corporation
0 cites
US12230563
2025
Method to Enable 30 Microns Pitch EMIB or Below
Intel Corporation
0 cites
US11676891
2023
Method to Enable 30 Microns Pitch EMIB or Below
Intel Corporation
0 cites