5 Patents
- US125724172026Translation Cache and Configurable ECC Memory for Reducing ECC Memory Overhead
Intel Corporation
0 cites - US125050652025On-package Die-to-die (D2D) Interconnect for Memory Using Universal Chiplet Interconnect Express (ucie) PHY
Intel Corporation
0 cites - 0 cites
- US123408632025Stacked Memory Chip Solution with Reduced Package Inputs/outputs (i/os)
Intel Corporation
0 cites - US122823662025System, Apparatus and Methods for Power Communications According to a CXL Power Protocol
Intel Corporation
0 cites