12 Patents
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- US119358572024Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures
Intel Corporation
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- US117372082023Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
0 cites - US117282652023Selective Deposition of Embedded Thin-film Resistors for Semiconductor Packaging
Intel Corporation
0 cites - US116705042023Ultra-thin Dielectric Films Using Photo Up-conversion for Applications in Substrate Manufacturing and Integrating Passives
Intel Corporation
0 cites - US116371712023Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, and Methods of Assembling Same
Intel Corporation
0 cites - US116058672023Fabricating an RF Filter on a Semiconductor Package Using Selective Seeding
Intel Corporation
0 cites - US115718762023Dielectric Film with Pressure Sensitive Microcapsules of Adhesion Promoter
Intel Corporation
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