Digvijay A. Raorane

6 Patents

• US125754172026

  Electronic Package Assembly with Stiffener

  Intel Corporation

  0 cites
• US121598132024

  Embedded Bridge Die with Through-silicon Vias

  Intel Corporation

  0 cites
• US120093182024

  Control of Warpage Using ABF GC Cavity for Embedded Die Package

  Intel Corporation

  0 cites
• US117422702023

  Landing Pad Apparatus for Through-silicon-vias

  Intel Corporation

  0 cites
• US115878512023

  Embedded Bridge with Through-silicon Vias

  Intel Corporation

  0 cites
• US115691732023

  Bridge Hub Tiling Architecture

  Intel Corporation

  0 cites