Patents/Inventors

Didier Landru

Le Champ-près-FrogesFR42 patents

23 Patents

US126221892026
Method for Manufacturing a Composite Structure Comprising a Thin Single-crystal Semiconductor Layer on a Carrier Substrate
Soitec
0 cites
US126171942026
Method of Manufacturing a Multilayer Structure
SOITEC
0 cites
US126159982026
Detachable Temporary Substrate Compatible with Very High Temperatures and Process for Transferring a Working Layer from the Substrate
Soitec
0 cites
US126036292026
Composite Structure and Associated Production Method
Soitec
0 cites
US125989232026
Method for Producing a Semiconductor Structure Comprising an Interface Region Including Agglomerates
SOITEC
0 cites
US125639962026
Holding Device for an Assembly That Is to Be Fractured
Soitec
0 cites
US124906562025
Hybrid Structure and a Method for Manufacturing the Same
Soitec
0 cites
US124697432025
Method for Preparing a Thin Layer That Includes Forming a Weakened Zone in a Central Portion of a Donor Substrate That Does Not Extend Into a Peripheral Portion of the Donor Substrate and Initiating and Propagating a Splitting Wave in the Weakened Zone That Does Completely Not Propagate Through the Peripheral Portion
Commissariat à L'énergie Atomique Et Aux éNergies Alternatives
0 cites
US124179422025
Process for Hydrophilically Bonding Substrates
Soitec
0 cites
US123200312025
Method for Manufacturing a Composite Structure Comprising a Thin Layer Made of Monocrystalline Sic on a Carrier Substrate Made of Sic
Soitec
0 cites
US121989832025
Method for Producing a Composite Structure Comprising a Thin Layer of Monocrystalline Sic on a Carrier Substrate of Polycrystalline Sic
Soitec
0 cites
US121659002024
Method of Mechanical Separation for a Double Layer Transfer
Soitec
0 cites
US121425172024
Method for Transferring a Useful Layer from a Donor Substrate Onto a Support Substrate by Applying a Predetermined Stress
Soitec
0 cites
US120947592024
Method for Transferring Blocks from a Donor Substrate Onto a Receiver Substrate by Implanting Ions in the Donor Substrate Through a Mask, Bonding the Donor Substrate to the Receiver Substrate, and Detaching the Donor Substrate Along an Embrittlement Plane
Soitec
0 cites
US120026972024
Method for Detecting the Splitting of a Substrate Weakened by Implanting Atomic Species
Soitec
0 cites
US120026902024
System for Fracturing a Plurality of Wafer Assemblies
SOITEC
0 cites
US119307102024
Hybrid Structure and a Method for Manufacturing the Same
SOITEC
0 cites
US118814292024
Method for Transferring a Useful Layer Onto a Support Substrate
SOITEC
0 cites
US118760152024
Method for Transferring a Useful Layer to a Carrier Substrate
Soitec
0 cites
US117768432023
Method for Transferring Blocks from a Donor Substrate Onto a Receiver Substrate by Implanting Ions in the Donor Substrate Through a Mask, Bonding the Donor Substrate to the Receiver Substrate, and Detaching the Donor Substrate Along an Embrittlement Plane
Soitec
0 cites
US117422332023
Method of Mechanical Separation for a Double Layer Transfer
Soitec
0 cites
US117428172023
Process for Transferring a Thin Layer to a Support Substrate That Have Different Thermal Expansion Coefficients
Soitec
0 cites
US116705402023
Substrates Including Useful Layers
Commissariat à L'énergie Atomique Et Aux éNergies Alternatives
0 cites