Patents/Inventors

Dewen Tian

ShandongCN4 patents

5 Patents

US121070532024
Shielding Process for SIP Packaging
Weifang Goertek Microelectronics Co., Ltd.
0 cites
US120740372024
Packaging Method for Circuit Units Comprising Circuit Baseplate
Weifang Goertek Microelectronics Co., Ltd.
0 cites
US120319202024
Method for Detecting Coverage Rate of Intermetallic Compound
Weifang Goertek Microelectronics Co., Ltd.
0 cites
US120026852024
Method for Packaging Chip
Weifang Goertek Microelectronics Co., Ltd.
0 cites
US118826812024
Electromagnetic Shielding Structure and Manufacturing Method Thereof, and Electronic Device
Weifang Goertek Microelectronics Co. Ltd.
0 cites