Devika Sarkar Grant

9 Patents

• US125572972026

  Leveling Dielectric Surfaces for Contact Formation with Embedded Memory Arrays

  International Business Machines Corporation

  0 cites
• US124944082025

  Double Patterned Microcooler Having Alternating Fin Widths

  International Business Machines Corporation

  0 cites
• US124380852025

  Via to Backside Power Rail Through Active Region

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US124179262025

  Circuit Interconnect Structure

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US123946602025

  Buried Power Rail After Replacement Metal Gate

  International Business Machines Corporation

  0 cites
• US123343982025

  Multilayer Dielectric Stack for Damascene Top-via Integration

  International Business Machines Corporation

  0 cites
• US122439132025

  Self-aligned Backside Contact Integration for Transistors

  International Business Machines Corporation

  0 cites
• US121486992024

  High Aspect Ratio Buried Power Rail Metallization

  International Business Machines Corporation

  0 cites
• US120465112024

  Selective Metal Residue and Liner Cleanse for Post-subtractive Etch

  International Business Machines Corporation

  0 cites