7 Patents
- US122666142025Molded Laser Package with Electromagnetic Interference Shield and Method of Making
STATS Chippac Pte. Ltd.
0 cites - US120465642024Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
STATS Chippac Pte. Ltd.
0 cites - US118429912023Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module
STATS Chippac Pte. Ltd.
0 cites - US116769112023Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
STATS Chippac Pte. Ltd.
0 cites - 0 cites
- US116520882023Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-package Modules with the Same
STATS Chippac Pte. Ltd.
0 cites - US115878822023Molded Laser Package with Electromagnetic Interference Shield and Method of Making
STATS Chippac Pte. Ltd.
0 cites