13 Patents
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- US126107992026Coating Method for Making Chip, Chip Substrate, and Chip
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
0 cites - US125989672026Through Silicon via Interconnection Structure and Method of Forming Same, and Quantum Computing Device
Tencent Technology (Shenzhen) Company Limited
0 cites - US125688052026Silicon Wafer and Method for Filling Silicon via Thereof
Tencent Technology (Shenzhen) Company Limited
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- US125506262026Method for Preparing Josephson Junction and Production Line Device
Tencent Technology (Shenzhen) Company Limited
0 cites - US125320752026Pan-tilt-zoom Module, Camera Module, and Electronic Device
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - US124118632025Privately Sharing Database Data Across Provider Network Regions
Amazon Technologies, Inc.
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- US120788182024Voice Coil Motor for Driving Liquid Lens and Lens Assembly Having Voice Coil Motor
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - 0 cites
- US119687662024Induction Heating System and Method for Silicon Steel Core with Self-adhesive Coating
BAOSHAN IRON & STEEL Co. Ltd.
0 cites - US118996852024Dividing Authorization Between a Control Plane and a Data Plane for Sharing Database Data
Amazon Technologies, Inc.
0 cites