58 Patents
- US125990072026Composite IC Die Package Including an Electro-thermo-mechanical Die (ETMD) with Through Substrate Vias
Intel Corporation
0 cites - US125990342026Microelectronic Structure Including Active Base Substrate with Through Vias Between a Top Die and a Bottom Die Supported on an Interposer
Intel Corporation
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- US125640902026Edge-aligned Template Structure for Integrated Packages Including an Integrated Circuit Device Within an Opening of the Template Structure
Intel Corporation
0 cites - US125061272025Package Architecture of Photonic System with Vertically Stacked Dies Having Planarized Edges
Intel Corporation
0 cites - US125061282025Package Architecture of Scalable Compute Wall Having Compute Bricks with Vertically Stacked Dies
Intel Corporation
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- US124226152025Nested Glass Packaging Architecture for Hybrid Electrical and Optical Communication Devices
Intel Corporation
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- US124009522025Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
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- US123006202025Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites - US122835352025IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
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- US122059152025Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
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- US121836492024IC Package Including Multi-chip Unit with Bonded Integrated Heat Spreader
Intel Corporation
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- US121425672024Coreless Architecture and Processing Strategy for Emib-based Substrates with High Accuracy and High Density
Intel Corporation
0 cites - US121425682024Multi-die Ultrafine Pitch Patch Architecture of Interconnect Bridge Over Glass Layer and Method of Making
Intel Corporation
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- US119843772024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
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- US119786852024Glass Core Patch with in Situ Fabricated Fan-out Layer to Enable Die Tiling Applications
Intel Corporation
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- US119358082024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119232672024IC Die with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119087932024Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
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- US118240182023Heterogeneous Nested Interposer Package for IC Chips0 cites
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- US117988872023Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
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- US117568892023Ultrathin Bridge and Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites - US117495772023IC Package Including Multi-chip Unit with Bonded Integrated Heat Spreader
Intel Corporation
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- US117355522023Microelectronic Package with Solder Array Thermal Interface Material (SA-TIM)
Intel Corporation
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- US116581112023Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites - US115812352023IC Package Including Multi-chip Unit with Bonded Integrated Heat Spreader
Intel Corporation
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- US115454412023Semiconductor Package Having Wafer-level Active Die and External Die Mount
Intel Corporation
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