65 Patents
- US125917272026Lane Repair and Lane Reversal Implementation for Die-to-die (D2D) Interconnects
Intel Corporation
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- US125050652025On-package Die-to-die (D2D) Interconnect for Memory Using Universal Chiplet Interconnect Express (ucie) PHY
Intel Corporation
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- US124558272025System, Apparatus and Methods for Performing Shared Memory Operations
Intel Corporation
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- US124059122025Link Initialization Training and Bring Up for Die-to-die Interconnect
Intel Corporation
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- US122598352025Disaggregation of Computing Devices Using Enhanced Retimers with Circuit Switching
Intel Corporation
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- US122228812025Logical Physical Layer Interface Specification Support for Pcie 6.0, Cxl 3.0, and UPI 3.0 Protocols
INTEL CORPORATION
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- US121894702025Forward Error Correction and Cyclic Redundancy Check Mechanisms for Latency-critical Coherency and Memory Interconnects
Intel Corporation
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- US121554742024Characterizing and Margining Multi-voltage Signal Encoding for Interconnects
Intel Corporation
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- US120560292024In-system Validation of Interconnects by Error Injection and Measurement
Intel Corporation
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- US118863122024Characterizing Error Correlation Based on Error Logging for Computer Buses
Intel Corporation
0 cites - US118608122024Serdes Link Training0 cites
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- US117898922023Recalibration of PHY Circuitry for the PCI Express (PIPE) Interface Based on Using a Message Bus Interface
Intel Corporation
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- US117431092023Link Layer Communication by Multiple Link Layer Encodings for Computer Buses
Intel Corporation
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- US117290962023Techniques to Support Multiple Protocols Between Computer System Interconnects
Intel Corporation
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- US116694812023Enabling Sync Header Suppression Latency Optimization in the Presence of Retimers for Serial Interconnect
Intel Corporation
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