9 Patents
- US123083692025Method of Manufacturing a Semiconductor Device and a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122887212025Fin Bending Reduction Through Structure Design
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US121835902024Method of Performing Gap Filling Including Filling Trenches Between Dummy Gate Stacks on Semiconductor Fins/strips with Semiconductor Material
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119014422024Method of Manufacturing a Semiconductor Device and a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US117107772023Semiconductor Device and Method for Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116770152023Method of Manufacturing a Semiconductor Device and a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116055432023Method of Gap Filling Using Conformal Deposition-annealing-etching Cycle for Reducing Seam Void and Bending
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. Ltd.
0 cites