19 Patents
- US126108222026Readily Assembled/disassembled Cooling Assembly for Immersion Cooled Semiconductor Chip Package
Intel Corporation
0 cites - 0 cites
- US125001372025Directly Impinging Pressure Modulated Spray Cooling and Methods of Target Temperature Control
Intel Corporation
0 cites - US124904102025Circuit Devices Integrated with Boiling Enhancement for Two-phase Immersion Cooling
Intel Corporation
0 cites - US124530542025Cooling Assembly with Strap Element to Diminish Lateral Movement of Cooling Mass During Installation of the Cooling Mass
Intel Corporation
0 cites - 0 cites
- 0 cites
- 0 cites
- US123099662025Thermally Conductive Chamber with Stiffening Structure for Thermal Cooling Assembly of Semiconductor Chip Package Under High Loading Force
Intel Corporation
0 cites - US122939562025Boiling Enhancement Structures for Immersion Cooled Electronic Systems
Intel Corporation
0 cites - US122793952025Patterned Bolster Plate and Composite Back Plate for Semiconductor Chip LGA Package and Cooling Assembly Retention
Intel Corporation
0 cites - 0 cites
- US121319772024Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
Intel Corporation
0 cites - 0 cites
- 0 cites
- US120573702024Vacuum Modulated Two Phase Cooling Loop Efficiency and Parallelism Enhancement
Intel Corporation
0 cites - 0 cites
- US118429432023Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
INTEL CORPORATION
0 cites