Patents/Inventors

David Gani

Choa Chu KangSG13 patents

13 Patents

US125576942026
Semiconductor Package with Gas Release Holes
STMICROELECTRONICS PTE Ltd
0 cites
US123640382025
Sensor Die Package
STMICROELECTRONICS PTE Ltd
0 cites
US123567432025
Slanted Glass Edge for Image Sensor Package
Stmicroelectronics PTE Ltd
0 cites
US121366082024
Multi-chip Package
STMICROELECTRONICS PTE Ltd
0 cites
US119963972024
Wafer Level Proximity Sensor
STMICROELECTRONICS PTE Ltd
0 cites
US119424962024
Slanted Glass Edge for Image Sensor Package
Stmicroelectronics Pte Ltd
0 cites
US119088312024
Method for Manufacturing a Wafer Level Chip Scale Package (WLCSP)
Stmicroelectronics PTE Ltd
0 cites
US118288752023
Proximity Sensor with Integrated ALS
STMICROELECTRONICS PTE Ltd
0 cites
US117424372023
WLCSP with Transparent Substrate and Method of Manufacturing the Same
STMICROELECTRONICS PTE Ltd
0 cites
US115858472023
Crack Detection Integrity Check
Stmicroelectronics Pte Ltd
0 cites
US115812802023
WLCSP Package with Different Solder Volumes
STMICROELECTRONICS PTE Ltd
0 cites
US115812892023
Multi-chip Package
STMICROELECTRONICS PTE Ltd
0 cites
US115629372023
Semiconductor Package with Protected Sidewall and Method of Forming the Same
STMICROELECTRONICS PTE Ltd
0 cites