Patents/Inventors

David C. Conklin

Saratoga Springs, NYUS4 patents

5 Patents

US125059982025
Method for Chuck Compensation via Wafer Shape Control
Tokyo Electron Limited
0 cites
US123810932025
Hybrid Patterning-bonding Semiconductor Tool
Tokyo Electron Limited
0 cites
US123745622025
Wafer Shape Control for W2W Bonding
Tokyo Electron Limited
0 cites
US122042532025
In-situ Lithography Pattern Enhancement with Localized Stress Treatment Tuning Using Heat Zones
Tokyo Electron Limited
0 cites
US119948072024
In-situ Lithography Pattern Enhancement with Localized Stress Treatment Tuning Using Heat Zones
Tokyo Electron Limited
0 cites