4 Patents
- US121702622024Method for Forming an Electrical Connection Between an Electronic Chip and a Carrier Substrate and Electronic Device
Stmicroelectronics (Grenoble 2) SAS
0 cites - 0 cites
- US117568742023Electronic Device Comprising a Chip and at Least One SMT Electronic Component
Stmicroelectronics (Alps) SAS
0 cites - US115575662023Method for Forming an Electrical Connection Between an Electronic Chip and a Carrier Substrate and Electronic Device
Stmicroelectronics (Grenoble 2) SAS
0 cites