9 Patents
- US123243612025Electrical Connections Between Dissimilar Materials at Cryogenic Temperatures
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - 0 cites
- US121503902024Downstop and Bump Bonds Formation on Substrates
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - 0 cites
- US120339812024Create a Protected Layer for Interconnects and Devices in a Packaged Quantum Structure
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US119087562024Interposer Chips and Enclosures for Quantum Circuits
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US118044422023Combined Backing Plate and Housing for Use in Bump Bonded Chip Assembly
International Business Machines Corporation
0 cites - US116769032023Combined Backing Plate and Housing for Use in Bump Bonded Chip Assembly
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - 0 cites