8 Patents
- 0 cites
- 0 cites
- US123693802025Transistor with Dielectric Spacers and Field Plate and Method of Fabrication Therefor
NXP USA, Inc.
0 cites - US123344162025Through Substrate via (TSV) Validation Structure for an Integrated Circuit and Method to Form the TSV Validation Structure
NXP USA, Inc.
0 cites - 0 cites
- 0 cites
- 0 cites
- US118239782023Through Substrate via (TSV) Validation Structure for an Integrated Circuit and Method to Form the TSV Validation Structure
NXP USA, Inc.
0 cites