12 Patents
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- US125754272026Defect-free Through Glass via Metallization Implementing a Sacrificial Resist Thinning Material
Intel Corporation
0 cites - US124761752025Glass Substrates Having Transverse Capacitors for Use with Semiconductor Packages and Related Methods
Intel Corporation
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- US117282652023Selective Deposition of Embedded Thin-film Resistors for Semiconductor Packaging
Intel Corporation
0 cites - US115749932023Package Architecture with Tunable Magnetic Properties for Embedded Devices
Intel Corporation
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