Patents/Inventors

Daria Doria

ComoIT1 patent

2 Patents

US124631632025
Integrated Circuit Chip Including a Passivation Nitride Layer in Contact with a High Voltage Bonding Pad and Method of Making
Stmicroelectronics S.r.l.
0 cites
US118879482024
Integrated Circuit Chip Including a Passivation Nitride Layer in Contact with a High Voltage Bonding Pad and Method of Making
Stmicroelectronics S.r.l.
0 cites