Daqiao Du

3 Patents

• US125925082026

  Wave Spring-based Interconnect Probes

  Intel Corporation

  0 cites
• US122668782025

  Electrical Interconnect with Improved Impedance

  Intel Corporation

  0 cites
• US121968072025

  Near Field Wireless Communication System for Mother to Package and Package to Package Sideband Digital Communication

  Intel Corporation

  0 cites