Patents/Inventors

Daniel Porwol

StraubingDE1 patent

2 Patents

US121129922024
Package Having an Electronic Component and an Encapsulant Encapsulating a Dielectric Layer and a Semiconductor Die of the Electronic Component
Infineon Technologies AG
0 cites
US116055722023
Electronic Component with Semiconductor Die Having a Low Ohmic Portion with an Active Area and a High Ohmic Portion on a Dielectric Layer
Infineon Technologies AG
0 cites