Patents/Inventors

Daniel Kappauf

GräfenbergDE2 patents

3 Patents

US124446712025
Semiconductor Component with Damped Bonding Surfaces in a Package with Encapsulated Pins
Siemens Aktiengesellschaft
0 cites
US119159902024
Method for Manufacturing a Power Module Unit
Siemens Aktiengesellschaft
0 cites
US118324252023
Support for Electric Components
Siemens Aktiengesellschaft
0 cites