Daniel James Dechene

9 Patents

• US125753992026

  Interconnect Structure Including Vertically Stacked Power and Ground Lines

  International Business Machines Corporation

  0 cites
• US125507112026

  Interconnection Fabric for Buried Power Distribution

  INTERNATIONAL BUSINESS MACHINES COPORATION

  0 cites
• US124008712025

  Metal Lines with Low Via-to-via Spacing

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US123639652025

  Stacked Transistor Layout for Improved Cell Height Scaling

  International Business Machines Corporation

  0 cites
• US120805592024

  Using a Same Mask for Direct Print and Self-aligned Double Patterning of Nanosheets

  International Business Machines Corporation

  0 cites
• US120684152024

  Precise Bottom Junction Formation for Vertical Transport Field Effect Transistor with Highly Doped Epitaxial Source/drain, Sharp Junction Gradient, And/or Reduced Parasitic Capacitance

  International Business Machines Corporation

  0 cites
• US119776142024

  Circuit Design Watermarking

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US118880482024

  Gate Oxide for Nanosheet Transistor Devices

  International Business Machines Corporation

  0 cites
• US118307782023

  Back-side Wafer Modification

  International Business Machines Corporation

  0 cites