Patents/Inventors

Daniel Charles Edelstein

White Plains, NYUS18 patents

12 Patents

US126222462026
Mandrel-pull-first Interconnect Patterning
International Business Machines Corporation
0 cites
US126158322026
Self-aligned Backside Contact Structure for Semiconductor Device Power Delivery
International Business Machines Corporation
0 cites
US125989802026
Front End of Line Processing Compatible Thermally Stable Buried Power Rails
International Business Machines Corporation
0 cites
US125884212026
Memory Element with a Hardmask Stack Having Different Stress Levels
International Business Machines Corporation
0 cites
US125882802026
Backsides Subtractive M1 Patterning with Backside Contact Repair for Tight N2P Space
International Business Machines Corporation
0 cites
US124827472025
Local Interconnects Having Different Material Compositions
International Business Machines Corporation
0 cites
US124532972025
Recessed Local Interconnect Semiconductor Memory Device
International Business Machines Corporation
0 cites
US123410992025
Semiconductor Backside Transistor Integration with Backside Power Delivery Network
International Business Machines Corporation
0 cites
US122725452025
Embedded Metal Contamination Removal from BEOL Wafers
International Business Machines Corporation
0 cites
US119551522024
Dielectric Fill for Tight Pitch MRAM Pillar Array
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US119375142024
High-density Memory Devices Using Oxide Gap Fill
International Business Machines Corporation
0 cites
US115574822023
Electrode with Alloy Interface
International Business Machines Corporation
0 cites