Patents/Inventors

Daniel C. Edelstein

White Plains, NYUS2 patents

3 Patents

USRE0504942025
Self-forming Embedded Diffusion Barriers
TESSERA LLC
0 cites
US118814332024
Advanced Copper Interconnects with Hybrid Microstructure
Tessera LLC
0 cites
US118044052023
Method of Forming Copper Interconnect Structure with Manganese Barrier Layer
Tessera LLC
0 cites