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Danfeng Yang
Wuxi City
CN
10 patents
8 Patents
US12593731
2026
Packaging Structure and Manufacturing Method Thereof
JCET GROUP CO., Ltd.
0 cites
US12581965
2026
Packaging Structure and Manufacturing Method Thereof
JCET GROUP CO., Ltd.
0 cites
US12550261
2026
Package Structure with Inductor, and Manufacturing Method Thereof
JCET GROUP CO., Ltd.
0 cites
US12500329
2025
Antenna Packaging Structure and Manufacturing Method Thereof
JCET GROUP CO., Ltd.
0 cites
US12482765
2025
Packaging Structure and Manufacturing Method Thereof
JCET GROUP CO., Ltd.
0 cites
US12249582
2025
SIP Package Structure
JCET GROUP CO., Ltd.
0 cites
US12148681
2024
Fan-out Package Structure and Method for Manufacturing the Same
JCET GROUP CO., Ltd.
0 cites
US11854949
2023
Package Structure Having a Plurality of Chips Attached to a Lead Frame by Redistribution Layer
JCET GROUP CO., Ltd.
0 cites