Daisuke Oya

4 Patents

• US123083052025

  Power Semiconductor Device

  MITSUBISHI ELECTRIC CORPORATION

  0 cites
• US122213892025

  Aluminum/ceramic Bonding Substrate and Method for Producing Same

  Mitsubishi Electric Corporation

  0 cites
• US118879042024

  Integrally Bonded Semiconductor Device and Power Converter Including the Same

  Mitsubishi Electric Corporation

  0 cites
• US115691412023

  Semiconductor Device Including a Groove Within a Resin Insulating Part Positioned Between and Covering Parts of a First Electrode and a Second Electrode

  Mitsubishi Electric Corporation

  0 cites