Daisuke Ikeda

15 Patents

• US126047562026

  Method for Manufacturing Semiconductor Device

  0 cites
• US125923872026

  Non-aqueous Electrolyte Secondary Battery

  SANYO Electric Co., Ltd.

  0 cites
• US125936572026

  Method for Manufacturing Semiconductor Device by Removing Carrier After Forming Re-distribution Layer

  0 cites
• US125852302026

  Timepiece Module and Electronic Timepiece

  CASIO COMPUTER CO., Ltd.

  0 cites
• US123844832025

  Shock Absorber and Saddle-type Vehicle

  Hitachi Astemo, Ltd.

  0 cites
• US123329572025

  Indicating Location Status

  GOOGLE LLC

  0 cites
• US123083942025

  Rectangular Secondary Battery

  SANYO Electric Co., Ltd.

  0 cites
• US122704532025

  Shock Absorber and Saddle-type Vehicle

  Hitachi Astemo, Ltd.

  0 cites
• US120772422024

  Shock Absorber and Saddle-type Vehicle

  Hitachi Astemo, Ltd.

  0 cites
• US120341422024

  Method of Producing Negative Electrode Plate for Non-aqueous Electrolyte Secondary Battery

  Prime Planet Energy & Solutions, Inc.

  0 cites
• US119677972024

  Puncture Forming Method, Sample Separating Method, Semiconductor Element Manufacturing Method, Semiconductor Laser Element Manufacturing Method, and Semiconductor Laser Element

  NUVOTON TECHNOLOGY CORPORATION JAPAN

  0 cites
• US119420822024

  Facilitating Communications with Automated Assistants in Multiple Languages

  GOOGLE LLC

  0 cites
• US119218032024

  Indicating Location Status

  GOOGLE LLC

  0 cites
• US119156922024

  Facilitating End-to-end Communications with Automated Assistants in Multiple Languages

  GOOGLE LLC

  0 cites
• US118757882024

  Facilitating End-to-end Communications with Automated Assistants in Multiple Languages

  GOOGLE LLC

  0 cites