Patents/Inventors

Daisuke Fujimoto

Chiyoda-kuJP2 patents

3 Patents

US122642242025
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Multilayer Printed Wiring Board, and Semiconductor Package
RESONAC CORPORATION
0 cites
US122564902025
Prepreg, Laminate, and Production Methods Therefor, as Well as Printed Circuit Board and Semiconductor Package
RESONAC CORPORATION
0 cites
US117952932023
Epoxy Resin, Epoxy Resin Composition, Resin Sheet, B-stage Sheet, C-stage Sheet, Cured Product, Metal Foil with Resin, Metal Substrate, and Power Semiconductor Device
RESONAC CORPORATION
0 cites