Patents/Inventors

Daisaku Matsukawa

HitachiJP10 patents

3 Patents

US126019702026
Photosensitive Resin Composition, Method for Manufacturing Patterned Cured Product, Cured Product, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, and Electronic Component
HD MICROSYSTEMS, Ltd.
0 cites
US123862572025
Photosensitive Resin Composition, Method of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, and Electronic Component
HD Microsystems, Ltd.
0 cites
US115927442023
Positive-type Photosensitive Resin Composition
HD MICROSYSTEMS, Ltd.
0 cites