11 Patents
- 0 cites
- US125404162026Method for Manufacturing a Semiconductor Substrate and Method for Suppressing Occurrence of Cracks in a Growth Layer
TOYOTA TSUSHO CORPORATION
0 cites - US125097952025Method for Manufacturing Aluminum Nitride Substrate, Aluminum Nitride Substrate, and Method for Forming Aluminum Nitride Layer
TOYOTA TSUSHO CORPORATION
0 cites - US124603152025Method for Manufacturing Semiconductor Substrates and Method for Suppressing Introduction of Displacement to Growth Layer
TOYOTA TSUSHO CORPORATION
0 cites - US123851582025Method for Manufacturing a Semiconductor Substrate by Forming a Growth Layer on an Underlying Substrate Having Through Holes
TOYOTA TSUSHO CORPORATION
0 cites - US123259362025Aluminum Nitride Substrate Manufacturing Method, Aluminum Nitride Substrate, and Method of Removing Strain Layer Introduced Into Aluminum Nitride Substrate by Laser Processing
TOYOTA TSUSHO CORPORATION
0 cites - US122550732025Silicon Carbide Substrate Manufacturing Method, Silicon Carbide Substrate, and Method of Removing Strain Layer Introduced Into Silicon Carbide Substrate by Laser Processing
TOYOTA TSUSHO CORPORATION
0 cites - US122373772025Sic Semiconductor Substrate, And, Production Method Therefor and Production Device Therefor
TOYOTA TSUSHO CORPORATION
0 cites - US121319602024Temperature Distribution Evaluation Method, Temperature Distribution Evaluation Device, and Soaking Range Evaluation Method
TOYOTA TSUSHO CORPORATION
0 cites - US120209282024Sic Semiconductor Substrate, Method for Manufacturing Same, and Device for Manufacturing Same
TOYOTA TSUSHO CORPORATION
0 cites