Dai Ishikawa

7 Patents

• US125648792026

  Copper Paste for Joining, Method for Manufacturing Joined Body, and Joined Body

  RESONAC CORPORATION

  0 cites
• US125448322026

  Copper Paste, Wick Formation Method, and Heat Pipe

  Resonac Corporation

  0 cites
• US122334602025

  Copper Paste, Wick Formation Method, and Heat Pipe

  Resonac Corporation

  0 cites
• US118879602024

  Member Connection Method

  RESONAC CORPORATION

  0 cites
• US117840432023

  Formation of Sin Thin Films

  ASM IP Holding, B.V.

  0 cites
• US116768122023

  Method for Forming Silicon Nitride Film Selectively on Top/bottom Portions

  ASM IP Holding B.V.

  0 cites
• US115750762023

  Method for Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, and Binder for Thermoelectric Conversion Module

  Showa Denko Materials Co., Ltd.

  0 cites