Patents/Inventors

Dae Jung Byun

Suwon-siKR7 patents

8 Patents

US122196922025
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118643072024
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117586502023
Flexible Printed Circuit Board and Electronic Device Including the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117440122023
Printed Circuit Board and Substrate Including Electronic Component Embedded Therein
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US116409522023
Electronic Component Embedded Substrate
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US116316432023
Substrate Embedded Electronic Component Package
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US115878782023
Substrate Having Electronic Component Embedded Therein
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US115762542023
Cable Substrate
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites