19 Patents
- 0 cites
- US125937032026Molded Bridge with Vertical Interconnects and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US125061022025Fully Molded Semiconductor Structure with Face Mounted Passives and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US125001972025Encapsulant-defined Land Grid Array (LGA) Package and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US124697762025Semiconductor Assembly Comprising a 3D Block and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US124380652025Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US124244502025Embedded Component Interposer or Substrate Comprising Displacement Compensation Traces (dcts) and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US123811542025Fully Molded Bridge Interposer and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US123343962025Unit Specific Variable or Adaptive Metal Fill and System and Method for the Same
Deca Technologies USA, Inc.
0 cites - US122611402025Stackable Fully Molded Semiconductor Structure with Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US122058812025Semiconductor Assembly Comprising a 3D Block and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US121702612024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US120573732024Stackable Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US119730512024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US118878622024Method for Redistribution Layer (RDL) Repair by Mitigating at Least One Defect with a Custom RDL
Deca Technologies USA, Inc.
0 cites - US117912072023Unit Specific Variable or Adaptive Metal Fill and System and Method for the Same
Deca Technologies USA, Inc.
0 cites - US117282482023Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US116643212023Multi-step High Aspect Ratio Vertical Interconnect and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US116160032023Stackable Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites