7 Patents
- US125885102026Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules
Google LLC
0 cites - US123157822025Spring Loaded Compliant Coolant Distribution Manifold for Direct Liquid Cooled Modules
Google LLC
0 cites - 0 cites
- US122438022025Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites - US119903862024Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites - US117216412023Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules
Google LLC
0 cites - US116643292023Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules
Google LLC
0 cites