Patents/Inventors

Collin Howder

Boise, IDUS23 patents

25 Patents

US125637872026
Electronic Devices Comprising a Stack Structure, a Source Contact, and a Dielectric Material
Micron Technology, Inc.
0 cites
US124827522025
Memory Circuitry and Method Used in Forming Memory Circuitry
Micron Technology, Inc.
0 cites
US124242822025
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US124190482025
Memory Circuitry and Method Used in Forming Memory Circuitry
Micron Technology, Inc.
0 cites
US124069322025
Memory Circuitry and Method Used in Forming Memory Circuitry
Micron Technology, Inc.
0 cites
US124083412025
Memory Arrays, and Methods of Forming Memory Arrays
Micron Technology, Inc.
0 cites
US123961722025
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US123566172025
Microelectronic Devices with Vertically Recessed Channel Structures and Discrete, Spaced Inter-slit Structures, and Related Methods and Systems
Micron Technology, Inc.
0 cites
US123566192025
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US122303252025
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US122009292025
Integrated Circuitry Comprising a Memory Array Comprising Strings of Memory Cells and Method Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US121855452024
Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
0 cites
US121676002024
Integrated Assemblies, and Methods of Forming Integrated Assemblies
0 cites
US121375642024
Methods of Forming Microelectronic Devices
Micron Technology, Inc.
0 cites
US120637822024
Integrated Assemblies Having Metal-containing Liners Along Bottoms of Trenches, and Methods of Forming Integrated Assemblies
0 cites
US120402532024
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US119729782024
Conductive via of Integrated Circuitry, Memory Array Comprising Strings of Memory Cells, Method of Forming a Conductive via of Integrated Circuitry, and Method of Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US119489922024
Electronic Devices Comprising a Dielectric Material, and Related Systems and Methods
Micron Technology, Inc .
0 cites
US118943052024
Microelectronic Devices Including Staircase Structures, and Related Memory Devices and Electronic Systems
0 cites
US118715662024
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
0 cites
US117372752023
Microelectronic Devices Including Filled Slits and Memory Cell Pillars, and Related Memory Devices and Electronic Systems
Micron Technology, Inc.
0 cites
US117372782023
Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US116902262023
Integrated Assemblies, and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US116784832023
Memory Arrays and Methods Used in Forming a Memory Array
Micron Technology, Inc.
0 cites
US115454302023
Integrated Circuitry and Method Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites